Kovar Package Cover
- Material: Kovar alloy
- Thickness: 0.5/0.6/0.7 mm
- Project Offer:Within 3 hours
- Process: Precision Etching
- Custom Cycle:Involving Mold Opening, – monthly sample delivery
- Production Capacity:5000-10000PCS/day
- Application: Semiconductor Packaging
- Add Process:Stamping, Self-Owned Hardware Mold Room, Electroplating, Electrophoresis, PVD Vacuum Plating
- Type: Kovar Etching
High-Quality Semiconductor Kovar Package Cover Etching
Metal-ceramic composite packaging cover plates, processed from thermal expansion series alloy materials and also known as Kovar alloy, are widely used in semiconductor, communication equipment, microwave device, hybrid integrated circuit, and industrial laser packaging. The main materials used are 4J29 and 4J42 alloys, which have thermal expansion coefficients close to ceramic phases. They are primarily employed for surface soldering in packaging applications such as crystal resonators, oscillators, surface acoustic wave (SAW) filters, and ICs.
These metal-ceramic composite packaging cover plates offer significant advantages through etching processes. They feature high dimensional accuracy, smooth and polished surfaces, uniform surface coatings, corrosion resistance, and salt spray resistance. They ensure stable current in parallel soldering and high hermeticity. In the field of optical communication, Kovar alloy packaging cover plates can encapsulate single and multiple chips, providing advantages such as compact structure, high optoelectronic conversion efficiency, stable performance, high reliability, long lifespan, and easy installation. They effectively provide electrical signal transmission channels and optocoupling interfaces for devices, addressing the interconnection needs between chips and external circuits.
Etching of metal-ceramic Kovar alloy packaging cover plates effectively guarantees the material’s performance. The thickness of etched Kovar alloy cover plates can range from 0.01 mm to 2 mm, allowing for versatility in various applications. Etching processes for Kovar alloy cover plates use chemical corrosion methods, enabling mass production without pressure, achieving smooth and precise surfaces, and meeting stringent dimensional tolerances required for miniaturization and precision.
Why Choose Our Semiconductor Kovar Package Cover Etching Service?
- Etching processing technology is adopted, with high precision, up to ±0.008mm (different thickness of different materials). 15 years of professional precision etching processing factory, the quality is trustworthy.
- The etching process of Be-cu has no restrictions on complex patterns and arbitrary geometric figures. No matter how complicated the hole shape or pattern is, it can be formed in one process without increasing the production cost.
- Be-cu chemical etching is a double-sided simultaneous processing technology. The surface of the product (front and back) is smooth, no bumps, no pits, no burrs, no warping, the mesh is flat and no deformation, no need to polish , Polishing, self-care process after flattening.
- The size of etching process is fine (aperture ≥ 0.1mm, thickness 0.03-2.0mm), and the positioning is accurate (minimum precision ± 0.008) uniform.
- The production cycle is short, the response is fast, and the design is easy to modify. The Be-cu professional etching technology engineering team has a total of 17 people and has senior technicians who have been in the industry for 15+ years.
- Be-cu samples are produced quickly, and samples can be produced within 1-2 working days (determined according to product requirements).
- Be-cu etching has 16 automatic etching production lines, with high etching processing output, which can meet your production orders for batch processing and etching customized microporous mesh.
- Be-cu provides auxiliary services such as stamping, welding, oil spraying, painting, electrophoresis, electroplating, electrolysis, passivation, polishing, stretching, wire drawing, silk screen LOGO, injection molding, etc., to meet the needs of different products and realize convenient and fast — One-stop processing service.
- Be-cu has passed the factory inspections of many well-known companies such as Gree, Joyoung, Xinbao, Xiaomi, Lake and American and German customers. The quality and delivery time are stable, and the customer satisfaction and employee satisfaction are high.
Contact Be Cu Now for your Custom Metal Etching, We are your best online Etching services choice!
Specifications of Semiconductor Kovar Package Cover Etching
| Material Type | Aluminium/Brass/Copper/Nitinol/Stainless steel/Titanium/Kovar |
| Size | Customized |
| Min. Hole Dia. | Dia.≥1.2xT |
| Min. Pitch | D≥1.0xT |
| Tolerance | 0.003mm |
| Material Thickness | T≥0.03mm |
| Process | Etching/Plating/Stamping/Bending/Laser cuting |
| Surface Finish | PVD/Coating/Painting |
| Inspection | IPQC/AQL |
| Packing | Plastic Tray or Customized |
