SOP Lead Frame
- Material: Ceramic Copper
- Thickness: 0.5/0.6/0.7 mm
- Project Offer:Within 3 hours
- Process: Precision Etching
- Custom Cycle:Involving Mold Opening, – monthly sample delivery
- Production Capacity:5000-10000PCS/day
- Application: Semiconductor Packaging
- Add Process:Stamping, Self-Owned Hardware Mold Room, Electroplating, Electrophoresis, PVD Vacuum Plating
- Type: Kovar Etching
High-Quality Ceramic Copper Clad Laminate By Precision Etching
Ceramic copper clad laminate is a composite material that utilizes a ceramic substrate (alumina or aluminum nitride) bonded with copper foil through a high-temperature sintering process. The main materials used can be brass, phosphor bronze, beryllium copper, red copper, purple copper, and white copper. The current processing methods primarily include laser cutting and drilling, chemical plating, and chemical etching.
Ceramic copper clad laminate has high product characteristics, including high thermal conductivity and low expansion coefficient, resistance to thermal cycling, and mechanical strength. It is particularly suitable for the design of PCBA boards in the field of new energy vehicles and for brake pad applications. It has strong current-carrying capacity, resistance to wear and chemical corrosion, and the processed products have relatively high flatness and surface gloss, making them less prone to bending, deformation, and warping. It also boasts excellent properties such as high insulation and dielectric strength.
In addition to ceramic copper clad laminate, there are also glass copper clad laminates. Besides its applications in the new energy vehicle sector, ceramic copper clad laminate etching is also notably effective in high-power LED ceramic copper-clad heat dissipation substrates.
Why Choose Our Precision Etched Ceramic Copper Clad Laminate Service?
- Etching processing technology is adopted, with high precision, up to ±0.008mm (different thickness of different materials). 15 years of professional precision etching processing factory, the quality is trustworthy.
- The etching process of Be-cu has no restrictions on complex patterns and arbitrary geometric figures. No matter how complicated the hole shape or pattern is, it can be formed in one process without increasing the production cost.
- Be-cu chemical etching is a double-sided simultaneous processing technology. The surface of the product (front and back) is smooth, no bumps, no pits, no burrs, no warping, the mesh is flat and no deformation, no need to polish , Polishing, self-care process after flattening.
- The size of etching process is fine (aperture ≥ 0.1mm, thickness 0.03-2.0mm), and the positioning is accurate (minimum precision ± 0.008) uniform.
- The production cycle is short, the response is fast, and the design is easy to modify. The Be-cu professional etching technology engineering team has a total of 17 people and has senior technicians who have been in the industry for 15+ years.
- Be-cu samples are produced quickly, and samples can be produced within 1-2 working days (determined according to product requirements).
- Be-cu etching has 16 automatic etching production lines, with high etching processing output, which can meet your production orders for batch processing and etching customized microporous mesh.
- Be-cu provides auxiliary services such as stamping, welding, oil spraying, painting, electrophoresis, electroplating, electrolysis, passivation, polishing, stretching, wire drawing, silk screen LOGO, injection molding, etc., to meet the needs of different products and realize convenient and fast — One-stop processing service.
- Be-cu has passed the factory inspections of many well-known companies such as Gree, Joyoung, Xinbao, Xiaomi, Lake and American and German customers. The quality and delivery time are stable, and the customer satisfaction and employee satisfaction are high.
Contact Be Cu Now for your Custom Metal Etching, We are your best online Etching services choice!
Specifications of Precision Etched Ceramic Copper Clad Laminate
| Material Type | Aluminium/Brass/Copper/Nitinol/Stainless steel/Titanium |
| Size | Customized |
| Min. Hole Dia. | Dia.≥1.2xT |
| Min. Pitch | D≥1.0xT |
| Tolerance | 0.003mm |
| Material Thickness | T≥0.03mm |
| Process | Etching/Plating/Stamping/Bending/Laser cuting |
| Surface Finish | PVD/Coating/Painting |
| Inspection | IPQC/AQL |
| Packing | Plastic Tray or Customized |
